21.01.2026

Autor:
Niels Krauch
Chief Technology Officer

Author:
Niels Krauch
Chief Technology Officer

21.01.2026

PCB Laser Cutting

PCB laser cutting describes the precise cutting and routing of printed circuit boards using laser-based processes. Unlike mechanical methods, laser cutting is a contactless technique that enables highly accurate contours, clean edges, and flexible design geometries. This makes it particularly suitable for modern PCB designs with fine structures, tight tolerances, and sensitive materials.

While this glossary focuses on PCB laser cutting, Photonics Systems Group develops industrial laser systems for a wide range of processing methods and material classes, including laser PCB depaneling, laser cutting of ceramic substrates and laser trimming, addressing complex electronics manufacturing requirements beyond PCB cutting applications.

Laser cutting

Laser cutting is a general manufacturing process that uses a focused laser beam to cut or separate materials with high precision. It is widely used across many industries, including electronics, semiconductor manufacturing, photovoltaics, and microfabrication. Depending on the application, laser cutting supports fine contours, narrow kerf widths, and minimal mechanical influence on the workpiece.

Readers looking for a deeper technical background can refer to the in-depth knowledge article on laser cutting, which explains core principles and process variants in detail.

Laser cutting of PCBs

PCB laser cutting is a specialized form of laser cutting, optimized for the requirements of printed circuit boards and electronic substrates. In electronics manufacturing, it enables precise contour cutting for complex PCB layouts. Laser cutting can be applied to a variety of PCB substrates, including standard FR-4, flex-rigid PCB, as well as Metal Core PCB (MCPCB) and Insulated Metal Substrates (IMS PCB). Related laser-based separation processes, such as laser depaneling, are applied where individual boards must be separated from a panel.

Laser cutting process on a printed circuit board using a focused laser beam for precise contour cutting.

PCB cutter

A PCB cutter is a tool or system used to separate printed circuit boards from a larger panel or to cut specific contours within a PCB. While mechanical PCB cutters rely on saws, milling, routing, die cutting or punching, laser-based PCB cutters use focused laser energy to achieve contactless material removal.

Laser cutter for PCB

A laser cutter for PCB applies laser technology specifically to cutting and routing tasks in PCB manufacturing. It enables precise cuts without mechanical stress, making it suitable for rigid PCBs, flexible printed circuits, and complex multilayer designs. Laser cutters for PCB applications are often used when fine structures, small radii, or sensitive materials must be processed reliably.

Laser cutting process on a printed circuit board, showing precise contour cutting inside an automated laser cutting system.

Laser cutting machine

A laser cutting machine is the hardware platform that integrates the laser source, motion system, optics, software, and process control required for laser-based material processing. In PCB manufacturing, laser cutting machines are configured to meet the specific demands of electronics production, including accuracy, repeatability, and process stability.

Laser cutting machine for PCB applications 

Laser cutting machines from the Photonics Systems Group are designed for high-precision laser processing tasks in electronics manufacturing. They enable cuts and smallest radii in the micrometer range without mechanical residues, supporting demanding PCB and substrate designs.

Automated depaneling machine using laser cutting technology for precise separation of printed circuit boards

Laser system for PCB laser cutting

These laser systems are specifically developed for cutting and routing flexible PCBs (FPCs), rigid PCBs and IC interposers, where mechanical methods reach their limits. Stable beam delivery, precise motion control, and application-optimized system configurations ensure reliable cutting quality across different materials and layouts.

Niels Krauch
Chief Technology Officer