Laser wafer trimming and fusing
Our sophisticated solutions are used from sensor production to highly complex mixed-signal circuits, proving their outstanding performance in 24/7 operation every day with our blue-chip customers around the globe.
How does wafer trimming work?
Our systems have been successfully trimming circuits at wafer level for decades, offering maximum flexibility for a wide range of production requirements. They can be equipped with various chuck materials and laser sources to achieve optimal results on the wafer. In addition to being used for offline fusing (also known as memory repair), the systems can be connected to external test systems via the ATI (Advanced Tester Interface). Equipped with an SECS/GEM interface and fully automated, the systems enable seamless integration into any production environment.
What are the advantages of laser wafer trimming or fusing?
We are your strong partner – from the feasibility study to selecting the optimal process machine and determining the appropriate level of automation – all from a single source.
Process stability
State-of-the-art wafer trimmer with self-check algorithms and a stable software interface.
No recalibration needed
Constant system accuracy of 0.5 µm without recalibration, thanks to Laser-Eye technology.
Highest efficiency
Opening of up to 2000 links per second and integration of ATE and PSG testers.
Automated processes
Fully automatable process control, including material handling.
What Is wafer trimming/wafer fusing used for?
In the manufacturing of modern mixed-signal devices, the precise use of laser technology enables real-time modification of electrical circuit properties. Test systems are either connected directly to the trim system to measure the circuits in real-time and fine-tune them using lasers (“Wafer Trim”), or pre-created fuse maps from offline testers are used to optimize the circuits based on the test results (“Wafer Fusing”).
These processes not only improve the accuracy of the circuits but also provide a cost-effective alternative to conventional e-fusing by reducing production costs and enhancing the quality of the end products.
How can we help you?
Rely on our expertise to ensure your long-term success. Get in touch with us now.
M350long pulse
Wafer trimmer with long pulse length
- Open Cassette Automation
- Link distance up to > 3.5µm
- Accuracy > 0.5µm
M350short pulse
Wafer trimmer with short pulse length
- Open Cassette Automation
- Link distance up to > 3.5µm
- Accuracy > 0.5µm
State-of-the-art application center
Get in touch with us today to discuss with our experts how we can solve your next manufacturing challenge together.
