Laser Processing of Ceramics
Our machine solutions for ceramic processing provide you with the opportunity to significantly improve critical properties such as fracture resistance and edge quality through ultrashort pulse lasers.
How does laser processing of ceramics work?
For the processing of ceramic printed circuit boards, we primarily use ultrashort pulse lasers and high-performance galvo systems to achieve optimal results with maximum cycle times. Our systems are versatile and suitable for cutting, scribing, and drilling. Upon request, they can also be equipped with metrology systems that verify the trench depth directly after the process.
What are the advantages of the Photonics Systems Group’s laser processing of ceramics?
We are your strong partner – from the feasibility study to selecting the optimal process machine and determining the appropriate level of automation – all from a single source.
Process stability
Defined fracture lines with constant depth enable precise separation of ceramic substrates.
Cut & edge quality
Smooth edges and improved fracture strength through precise laser processes.
Minimal heat load
Reduced thermal damage through the use of extremely short laser pulses.
High speed
High-speed processing with galvo scanners ensures short process times.
Versatility
Suitable for a wide range of ceramic materials and the creation of any geometries.
Precise drilling
Smallest hole diameters and flexible drilling techniques for ideal hole geometries.
What Is laser processing of high-performance ceramic materials used for?
Ceramics play a key role in the manufacturing of modern high-performance electronics due to their unique properties such as high temperature resistance, electrical insulation, mechanical strength, and chemical stability. The processing of ceramics with ultrashort pulse lasers offers outstanding possibilities and significantly improves critical properties such as fracture resistance and edge quality compared to pre-scribing and processing with CO₂ lasers.
How can we help you?
Rely on our expertise to ensure your long-term success. Get in touch with us now.
CR2000
Laser system for the individual processing of ceramic substrates
- Green picosecond for the smallest hole diameters
- < <5µm accuracy
- Fully automatable
CR2010
Laser system for processing ceramic circuit boards
- Green picosecond for the smallest hole diameters
- < <5µm accuracy
- Fully automatable
CR2020
Laser system for processing DCB and AMB circuit boards in power electronics
- IR picosecond for maximum process speed
- Optional metrology
- Fully automatable
State-of-the-art application center
Get in touch with us today to discuss with our experts how we can solve your next manufacturing challenge together.
