Laser Processing Machines

Our laser systems are the core of precise, reliable and highly efficient production processes in the photovoltaic, electronics and semiconductor industries. As a development partner and manufacturer, we deliver more than machines – we provide fully engineered end-to-end solutions, perfectly aligned with the material, the application and the production environment.

Overview of our laser systems

We offer a broad range of industrial laser systems designed for different processing methods and material classes. Our portfolio includes solutions for depaneling, PCB drilling, PCB routing, PCB structuring, wafer trimming, laser trimming, ceramic processing and laser applications for the photovoltaic industry. All systems are built on modular platforms that can be flexibly configured and seamlessly integrated into existing production lines.


Depending on the specific requirements, various laser types and process modules are used – from high-precision structuring of thin films to ultra-fine laser cutting of complex printed circuit boards.

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Laser systems for high-speed depaneling DP10x0

The DP10x0 series is a high-performance laser system designed for the precise separation of rigid and flexible printed circuit boards. Its efficient FULL-CUT process ensures optimal material utilization, making it ideal for cost- and resource-efficient production workflows. As an experienced laser system manufacturer, we offer a modular solution tailored to the needs of modern electronics manufacturing.

Laser system for microvia drilling and routing DR20x0 and DR30x0

These laser systems are specifically designed for microvia drilling and precise routing on printed circuit boards. With 10 µm accuracy and Infinity Scan technology, they ensure consistently high processing quality. At the same time, they offer flexible configuration options to meet a wide range of production requirements.

Ultra-fine laser cutting at wafer level WT35x0

The WT35x0 laser system is engineered for high-precision trimming of circuits on wafers as they also occur in semiconductor technology and power electronics. It enables extremely fine cuts down to 2 µm. An intelligent staging system and state-of-the-art laser sources make it the ideal tool for demanding wafer-level applications.

Versatile laser trimmer for electronics LT50x0

The LT50x0 series is a flexible laser system designed for precise trimming of electronic components and sensors. Various laser sources and high-precision measurement technology ensure accurate results at high processing speeds. As a laser system manufacturer, we combine technological expertise with advanced automation capabilities in this platform.

Laser system for ceramic processing CR20x0

This laser system is designed for the precise processing of ceramic materials such as Al₂O₃ or AlN. Thanks to ultrashort-pulse laser technology and laser ablation, even hole diameters starting at 30 µm can be achieved.

DIMENSO: Laser systems for the photovoltaic industry

For applications in the photovoltaic industry, the Photonics Systems Group develops modular laser systems that can be adapted to specific process requirements. The systems can be configured either as stand-alone machines or for inline production, and are suitable for 24/7 operation as well as for R&D or pilot manufacturing.

Areas of application for our laser systems: Processes & materials

Our laser systems process materials such as glass, ceramics, flexible substrates, metals, and multilayer composites with the highest precision—non-contact, burr-free, and with reliable process stability. Typical applications of our laser material processing include laser cutting, structuring, drilling, and trimming—either as stand-alone systems or fully integrated inline within automated production environments.

Custom laser systems for your application

Whether for prototyping, small-series production or high-throughput manufacturing, we develop laser systems precisely tailored to your application. We support you throughout the entire process: from technical consulting and process development to system integration, commissioning and global service.

Two employees in white shirts examine samples and discuss a modern laser system in a laboratory.

Process reliability

Our systems are designed to deliver stable, reproducible results from day one – even when processing sensitive materials or operating within tight tolerances.

Flexible configuration

Thanks to our modular platform concept, the machines can be precisely adapted to specific requirements and production environments.

In-house development

The laser source, control system, optics and software are developed in-house or in close technology partnerships – ensuring maximum control over performance and future development.

Integration into your production

Our laser systems integrate seamlessly into existing production lines and can be easily automated, networked and connected to established quality assurance systems.

Laser technology and 
system integration

Technologically, we rely on UV, IR and ultrashort-pulse lasers, available in various pulse durations and power classes depending on the application requirements. Our control and software solutions enable precise process control and seamless data connectivity. Thanks to our modular system architecture, our laser systems can be individually configured – scalable from laboratory environments to high-volume production.