Laser drilling of printed circuit boards and IC substrates
Whether as a multi-use tool for routing and drilling for efficient processing of rigid and flexible PCBs, or as a specialized version for drilling interconnects – we are at your side with unique process expertise.
How Does laser drilling of PCBs Work?
The laser, as a highly precise tool for drilling PCBs, is particularly efficient for microvias with diameters of 80 µm and smaller. Using state-of-the-art galvo technology, the laser allows for various drilling strategies, such as trepanning or percussion drilling, to be applied flexibly and adapted within the workpiece. No tool changes are required, and the laser operates completely wear-free.
What are the advantages of the laser drilling solutions from the Photonics Systems Group?
We are at your side as a strong partner – from the feasibility study to the selection of the optimum process machine and the appropriate level of automation – all from a single source.
Process stability
Maximum microvia reliability and low maintenance costs thanks to the contactless process.
Minimal heat load
Precise energy localization and superior process quality
Maximum flexibility
Customizable via diameters, material versatility, and adjustable taper angles for maximum flexibility.
High precision
Minimal hole-to-hole distances, smallest landing pads, and variable hole diameters ranging from 10 to 150 µm.
What is laser drilling used for?
Modern PCBs face the challenge of integrating increasingly complex and powerful electronic components. This necessitates a growing number of blind vias and reduced line spacing.
An efficient method is laser drilling: it is a contactless process that enables precise blind vias with diameters ranging from 150 µm to 10 µm, thus meeting the advancing miniaturization requirements without significantly impacting production costs.
The laser enables the processing of various materials, from classic FR4 to high-tech materials like ABF.
How can we help you?
Rely on our expertise to ensure your long-term success. Get in touch with us now.
DR2000
Laser system for drilling and routing PCBs with a green laser
- Green high-power USP laser
- Panel size up to 530×610 mm
- InfinityScan
DR2010
Laser system for drilling and routing PCBs with UV laser
- UV high power USP laser
- Panel size up to 530×610 mm
- InfinityScan
DR3000
Laser system for large substrates for drilling and routing PCBs with a green laser
- Green high-power USP laser
- Panel sizes up to 736×736 mm
- InfinityScan
DR3010
Laser system for large substrates for drilling and routing PCBs with UV laser
- UV high power USP laser
- Panel sizes up to 736×736 mm
- InfinityScan
State-of-the-art application center
Get in touch with us today to discuss with our experts how we can solve your next manufacturing challenge together.
Frequently asked questions about laser drilling
Quick answers to any questions you may have.
What Is laser drilling?
In laser drilling, short laser pulses with high power density are directed onto a workpiece. The material is removed (ablated) through the energy delivered by the laser radiation—depending on the pulse duration—in various ways: it is melted, vaporized, or ionized. The greater the energy of a pulse, the more material is ablated. The duration of each pulse is critical to the quality of the drilling. Shorter pulse durations significantly reduce the thermal load on the workpiece
During ablation, the material volume in the drill hole increases abruptly, generating high pressure. This pressure expels the molten material from the drill hole completely and residue-free in a very short time.
What is trepanning?
Trepanning involves first drilling vias (holes) using the percussion method. These are then expanded to the desired diameter through trepanning. This is achieved by creating a rotational movement of the laser beam relative to the workpiece. The advantage of this method lies in the reduced formation of melt layers on the walls of the hole, making it particularly suitable for producing delicate workpieces.
What Is percussion drilling?
In percussion drilling, the laser radiation does not hit the material in a single long pulse, but rather in several short pulses. This causes a small amount of material to melt and vaporize with each pulse. The vaporized material then pulls the molten material out of the hole. This method is also suitable for processing extremely hard materials.
What are the advantages of laser drilling compared to conventional methods?
In mechanical drilling, the hole is created by cutting material using a drill tool with a defined cutting edge. This generates chips that can contaminate or even damage the workpiece. The diameter and quality of the hole depend on the diameter of the drill tool and its wear. Different diameters require different drill tools, leading to non-value-adding tool changes and significant tool costs due to the limited lifespan of the tools. Additionally, there is a risk that drill bits may break during use, potentially destroying the workpiece.
Laser-based drilling eliminates the need for lengthy setup times to change drill tools and removes the issue of tool wear on drill heads. The ablation process of laser drilling ensures residue-free holes and a chip- and dust-free processing environment. The process stability of laser machines is uniquely high, as our fully calibrated systems provide absolutely stable processing conditions for years, which can also be directly replicated on new machines. For example, a process qualified in Europe can be seamlessly transferred to production facilities at outsourced locations with the push of a button.
What applications is laser drilling suitable for?
Our portfolio includes products and solutions with the following process capabilities:
- Drilling through-holes
- Drilling vias (blind holes)
- Removing cover layer materials
The exceptional flexibility of our laser drilling systems is particularly evident in small production runs!
What are the advantages of USP lasers over CO2 lasers?
USP lasers operate with pulses in the picosecond range, whereas CO2 lasers use significantly longer laser pulses. The heat-affected zone of a picosecond laser is much smaller than that of a nanosecond or CO2 laser. The reason for this is the shorter pulse duration, resulting in a “colder” ablation. As a result, no particles of solidified melt fall back onto the workpiece. In other words, USP lasers directly vaporize the material, rather than first melting it as CO2 lasers do. Energy losses in the form of heat are also drastically reduced by direct vaporization, significantly enhancing process efficiency.
Is it worth investing in a laser drilling system?
Yes, especially since the follow-up costs of conventional drilling systems and tools (wear, setup times, material waste, etc.) are eliminated. Laser drilling systems operate wear-free, require fewer labor hours, and increase your value creation. Setup times are significantly reduced, offering a clear competitive advantage and improving internal processes. The price/performance ratio of a laser drilling system is now 10 times better than it was 10 years ago, making these systems economically viable even for small and medium-sized enterprises.
How small can a laser hole be?
Laser drilling with an ultrafast laser typically has diameters ranging from 20 to 500 µm. Depending on the requirements and drilling method, our systems can achieve drilling diameters as small as 10 µm.