Laser depaneling of assembled printed circuit boards
Our unique process expertise enables you to achieve the optimum result for your specific requirements. Our machine solutions are user-friendly, designed for 24/7 industrial operation and can be fully automated on request.
How does laser depaneling work?
In laser depaneling, the laser beam is guided quickly and precisely over the substrate with the help of a galvanometer scanner in order to remove the substrate layer by layer. By precisely adjusting the laser power and the number of passes, an optimum compromise between quality and speed can be achieved. A powerful process extraction system adapted to your requirements guarantees a virtually residue-free process.
What are the advantages of the Photonics Systems Group’s laser depaneling solutions?
We are at your side as a strong partner – from the feasibility study to the selection of the optimum process machine and the appropriate level of automation – all from a single source.
PCB material savings
Efficient use of material & precise cuts up to 5µm for very small tolerances.
Low operating costs
No tool wear due to the laser, thus eliminating the costs for tool changes and maintenance.
Flexibility in design and application
Versatile material selection and complex cutting contours.
Increased yield
The use of full-cut technologies makes the use of tabs superfluous.
Automation & integration
From stand-alone systems to fully integrated production lines, Industry 4.0-capable.
Process stability
Reduced failure rates and reproducible process quality.
What is depaneling?
Modern electrical appliances are getting smaller, which also reduces the size of the circuit boards while increasing their functionality. While this is good for users, it makes production much more difficult. To simplify production, several PCBs are therefore combined to form a so-called panel. At the end of the manufacturing process, the individual PCBs must be separated from the panel. This process is known as depaneling.
How can we help you?
Rely on our expertise to ensure your long-term success. Get in touch with us now.
DP1010
Stand-alone high-speed laser depaneling machine with SMEMA interface
- Up to 2 laser heads
- Upstream and downstream SMEMA interface
- Optional conveyer available
DP1020
Fully automated high-speed laser depaneling machine with JEDEC tray feeder
- Up to 2 laser heads
- Upstream and downstream SMEMA interface
- Optional conveyer available
DP1030
Fully automated in-line high-speed laser depaneling machine for integration into your assembly line
- Up to 2 laser heads
- Upstream and downstream SMEMA interface
- Optional conveyer available
DP1040
Fully automated high-speed laser depaneling machine with thermoforming tray feeder
- Up to 2 laser heads
- Upstream and downstream SMEMA interface
- Optional conveyer available
State-of-the-art application center
Get in touch with us today to discuss with our experts how we can solve your next manufacturing challenge together.
Frequently asked questions about laser depaneling
Quick answers to any questions you may have.
Is laser depaneling more expensive than mechanical depaneling processes?
Compared to mechanical cutting processes (milling, punching), InnoLas laser depaneling offers you many economic advantages:
- Fast production processes, more throughput
- No changing or wearing out of tools
- Longer service life of the machine (wear-free)
- Less material loss due to more filigree contour guides and closer positioning – distances between PCBs <0.5mm possible
- Fewer rejects thanks to contactless, vibration-free cutting and more stable processes
- Higher product quality and fewer rejects, including in after-sales of end products
Is depaneling with the laser slower than milling?
On the contrary. Thanks to full automation with up to eight laser heads (multi-head system with Multi Beam Technology), a speed many times faster than that of a conventional milling machine can be achieved. Marking on the fly (MOF) perfectly synchronizes the movement of the panel with the movement of the laser beam. This saves an additional 40% of processing time.
The integration of an optimized scanner increases the accuracy in processing and the throughput in production, thus generating added value for the customer. The modular systems from Photonics Systems Group achieve +/- 5 µm accuracy. Stitching errors are avoided thanks to the overall processing of the pattern. Pulse on Demand (POD) also guarantees extremely precise processing. Our machines therefore control and regulate the amount of energy applied at each location on the components, regardless of the complexity of the layout. At the same time, throughput is increased as travel distances and subsequent calibration as well as downtimes are eliminated.
Are the components heated up strongly by the laser during depaneling and thus damaged?
No, because with our laser depaneling solutions, the heat input is not significant (HAZ/heat affection zone). We use ultra-short pulse lasers that do not heat the material. Instead of burning and forming soot, the material is vaporized directly during depaneling in a quasi-cold process. The cut edges are therefore absolutely clean and can be cut to size. 100 % carbonization-free. The temperature influence in the cutting area is only 30°-50°, i.e. lower than in the upstream soldering process.
What methods are available for depaneling?
Classic methods for depaneling are cutting or scoring with wedge-shaped knives and cutting with a depaneling cutter or a saw. Depaneling with a laser is already an established process. Its advantages lie primarily in the high production quality, the very precise and gentle material processing without carbonization or similar and the fast processing times in production.
What is depaneling?
Modern electrical appliances are becoming increasingly compact, resulting in reduced circuit board sizes while expanding their functionality. While this benefits users, it complicates production. To simplify the process, multiple PCBs are combined into a single panel. Several PCBs are manufactured and assembled within large panels, also referred to as panel assemblies. At the end of the production process, the individual PCBs must be separated from the panel in a process known as depaneling.
How much does a laser depaneling machine cost?
The price naturally depends very much on the size and features of the machine in question.
However, laser machines are no longer much more expensive than a milling machine. In addition, the additional costs are usually quickly amortized by the elimination of wear parts and the higher production capacity. The calibrated processes also mean that significantly fewer start-up parts and rejects are produced. The price/performance ratio of laser cutting systems has improved by a factor of 10 over the past 10 years.
How does depaneling with lasers work?
When cutting PCB panels with a laser, the assembled PCBs are cut from a panel by a focused laser beam that vaporizes the material directly, layer by layer, very quickly. Lasers can be used to create any number of extremely fine structures very easily. The vapors produced during the cutting process are extracted, which also ensures that no deposits or residues remain on the finished product.