Laser structuring of printed circuit boards
Our unique process expertise enables you to achieve the optimum result for your specific requirements. Our machine solutions are user-friendly, designed for 24/7 industrial operation and can be fully automated on request.
How does laser structuring of PCBs work?
The process of direct laser structuring of printed circuit boards is particularly suitable for the production of small series such as probe cards. The copper layer is removed down to the underlying dielectric by laser. The process can be used selectively and therefore reliably with high yields. Elaborate exposure and etching steps are no longer necessary and enable faster and more cost-effective production.
What are the advantages of the Photonics Systems Group’s laser structuring solutions?
We are your strong partner – from the feasibility study to selecting the optimal process machine and determining the appropriate level of automation – all from a single source.
Economical & efficient
Fewer process steps thanks to direct laser structuring of the copper top layer of printed circuit boards.
Environmentally friendly
Environmentally harmful materials and residues are significantly reduced.
Minimal heat load
Strong localization of the energy input by means of ultrashort pulses.
Maximum flexibility & precision
Very fine and precise structures can be created on a variety of materials.
What is laser structuring?
Laser structuring is a non-contact process in which a pulsed laser beam locally vaporizes the material. Thanks to ultrashort pulse laser technology, this process is fast and gentle on the material with minimal heat development to avoid delamination effects. It has been used for almost two decades in the series production of printed circuit boards to define electronic tracks directly on the surface without masking and etching processes.
How can we help you?
Rely on our expertise to ensure your long-term success. Get in touch with us now.
DR2000
Laser system for drilling and routing PCBs with a green laser
- Green high-power USP laser
- Panel size up to 530×610 mm
- InfinityScan
DR2010
Laser system for drilling and routing PCBs with UV laser
- UV high power USP laser
- Panel size up to 530×610 mm
- InfinityScan
DR3000
Laser system for large substrates for drilling and routing PCBs with a green laser
- Green high-power USP laser
- Panel sizes up to 736×736 mm
- InfinityScan
DR3010
Laser system for large substrates for drilling and routing PCBs with UV laser
- UV high power USP laser
- Panel sizes up to 736×736 mm
- InfinityScan
State-of-the-art application center
Get in touch with us today to discuss with our experts how we can solve your next manufacturing challenge together.
Frequently asked questions about laser structuring
Quick answers to any questions you may have.
Can laser systems perform several work steps?
Yes! In addition to structuring, the Photonics Systems Group’s laser systems can also be used for marking, drilling, creating cavities and cutting, depending on the design.as required for depaneling, for example. Even in these applications, a laser system achieves an accuracy and speed that is far higher than that of conventional processes. The InnoLas Solution systems are even capable of running the corresponding processes in parallel.
What other methods are there for structuring printed circuit boards?
Photochemical processes, in which a layer of light-sensitive lacquer on the metallic conductor plate is exposed through a mask and then etched accordingly, are still the most widespread worldwide. This process not only leads to the aforementioned environmental impact, but also delays production, as the components cannot be processed in any other way during the process. Laser structuring, on the other hand, produces no chemical waste and further work steps can be carried out simultaneously during structuring.
Milling is a process used primarily in the production of prototypes. This involves mechanically structuring layers of copper. This process naturally causes metal dust and chips on the workpiece, and the milling head wears out quickly and therefore needs to be readjusted regularly. This also causes considerable loss of time and waste. A laser system, on the other hand, vaporizes the coating without leaving any residue.
What applications are the Photonics Systems Group’s laser systems suitable for?
Our laser systems are suitable for a wide range of applications in almost all areas of the electrical industry. We are one of the leading suppliers of laser systems for absolutely residue-free and carbonization-free depaneling. If scoring is required before the final separation of the benefit, we also have a solution for this. Our systems are also suitable for laser drilling micro vias with high aspect ratios and diameters of up to 15 µm. To take account of the increasing miniaturization of modern electronic devices and their printed circuit boards, we also offer extensive solutions in the area of cavity production.
Of course, we combine all these solutions in a single laser system. In some cases, the individual processes can even be executed in parallel. Only laser cutting systems are this comprehensive and efficient!
Which lasers are used for structuring?
Our systems exclusively use ultrashort pulse lasers in the femtosecond and picosecond range in the ultraviolet, green and infrared parts of the spectrum. As a result, the heat input to the workpiece is significantly lower than with lasers used in the past, which worked with longer pulses. These properties ensure that the material to be removed evaporates without leaving any residue and that no carbonization occurs.