M350
Wafer Trimmer M350
Perfect for precise trimming and matching of circuits at wafer level using state-of-the-art laser control and exact positioning systems.
M350
Highlights
Thanks to modern integration and precise control, the machines in this series guarantee maximum efficiency and accuracy in wafer processing.
- Fully integrated, state-of-the-art laser trimmer and test system for wafer processing
- Control over the laser source enables process consistency with maximum yield
- Advanced image processing and motion systems offer significantly improved positioning options
- Short- or long-pulse laser sources are optionally available
M350long pulse
Wafer trimmer with long pulse length
- Open Cassette Automation
- Link distance up to > 3.5µm
- Accuracy > 0.5µm
M350short pulse
Wafer trimmer with short pulse length
- Open Cassette Automation
- Link distance up to > 3.5µm
- Accuracy > 0.5µm
Wafer Trimmer M350
The M350 Wafer Trim System from the Photonics Systems Group was designed from the outset for processing wafers and is therefore able to cut 2 µm wide links.
A high-precision staging system (x, y, z, theta), in combination with a powerful steel deflection system including feedback loop, enables the µm-precise positioning of the individual laser pulses on the wafer to be processed.
A high-resolution camera system is used to detect the structures.
250m² laser test
High-quality equipment
State-of-the-art laser technology
Experienced team