WT35X0
Wafer Trimmer WT35X0
Perfect for precise trimming and matching of circuits at wafer level using state-of-the-art laser control and exact positioning systems.
WT35X0
Highlights
Thanks to modern integration and precise control, the machines in this series guarantee maximum efficiency and accuracy in wafer processing.
- Fully integrated, state-of-the-art laser trimmer and test system for wafer processing
- Control over the laser source enables process consistency with maximum yield
- Advanced image processing and motion systems offer significantly improved positioning options
- Short- or long-pulse laser sources are optionally available
WT3520long pulse
Wafer trimmer with long pulse length
- Open Cassette Automation
- Link distance up to > 3.5μm
- Accuracy > 0.5μm
WT3510short pulse
Wafer trimmer with short pulse length
- Open Cassette Automation
- Link distance up to > 3.5μm
- Accuracy > 0.5μm
Wafer Trimmer WT35X0
The WT35X0 Wafer Trim System from the Photonics Systems Group was designed from the outset for processing wafers and is therefore able to cut 78 microinches wide links. A high-precision staging system (x, y, z, theta), in combination with a powerful steel deflection system including feedback loop, enables the microinch-precise positioning of the individual laser pulses on the wafer to be processed. A high-resolution camera system is used to detect the structures.
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250m² laser test
High-quality equipment
State-of-the-art laser technology
Experienced team