Our Laser Processing Machines
Our high-precision laser systems deliver µm-level accuracy and flexible configurability for a wide range of applications. Whether in research or series production, we develop customized solutions that ensure maximum efficiency and reliability in 24/7 operation.
Circuit and Sensor Trimmer LT50x0
The LT50x0 Trim System is the latest generation of systems for µm-accurate laser trimming of electronic components. It can be operated either with a proprietary measuring bridge or with an externally integrated measurement system. A precise stage system (x, y, z, theta) and a high-resolution camera system ensure accurate positioning and reliable component registration.
Lasertool for machining of ceramics CR20x0
The CR20x0 delivers exceptional precision in the production of ceramic circuit boards. Linear motors enable fast and dynamic axis movements, while high-resolution glass scales in each axis ensure impressive accuracy.
Laser for microvia drilling and routing DR20x0 and DR30x0
The DR20x0 and DR30x0 series meet all requirements for precise drilling and routing of rigid and flexible PCBs. Picosecond lasers ensure minimal heat-affected zones and maximum process control.
With InfinityScan, stage and galvo are controlled simultaneously, eliminating stitching errors and achieving exceptional contour accuracy.
Lasertool for structuring DR20x0 and DR30x0
As the market leader in structuring printed circuit boards, we deliver precision up to +/- 5 µm. With a range of laser options and system configurations, we provide the ideal machine for every process—perfectly tailored to your balance of cost and quality.
High-speed depaneling DP10x0
The DP10x0 series enables fast, clean, and stress-free depaneling of rigid and flexible PCB materials. The FULL-CUT process increases material utilization and lowers costs. Thanks to modular automation concepts, the series can be seamlessly integrated into any production line.
Laser systems for the photovoltaic industry
Our laser systems for the photovoltaic industry are designed for maximum efficiency in 24/7 operation. Thanks to modular platforms, they adapt flexibly to any application, whether for pilot production, R&D, or inline integration. The laser source is always optimally configured for the specific process.
Wafer Trimmer M350
The M350 Wafer Trim System is specifically designed for trimming 2 µm wide links on wafers. A high-precision stage system (x, y, z, theta), combined with a powerful steel deflection system featuring a feedback loop, enables µm-accurate laser positioning. A high-resolution camera system ensures precise structure detection.
