Wafer Trimmer M350

The M350 Wafer Trim System from the Photonics Systems Group was designed from the outset for processing wafers and is therefore able to cut 2 µm wide links.
A high-precision staging system (x, y, z, theta), in combination with a powerful steel deflection system including feedback loop, enables the µm-precise positioning of the individual laser pulses on the wafer to be processed.
A high-resolution camera system is used to detect the structures.