© 2024 Photonics Systems GmbH Legal notice | Privacy Policy | Whistleblowing system
InnoLas Solutions, L-TRIS and ProAut Technologies are now PHOTONICS SYSTEMS GROUP. Learn more about or company story here.
Laser wafer trimming and fusing
In the production of modern mixed-signal devices, the precise use of laser technology enables real-time modification of the electrical circuit properties.
Either test systems are connected directly to the trim system in order to measure the circuits in real time and fine-tune them using lasers (“wafer trim”), or previously created fuse maps from offline testers are used to optimize the circuits according to the test results (“wafer fusing”).
These processes not only improve the accuracy of the circuits, but also offer a cost-effective alternative to conventional e-fusing by reducing production costs and increasing the quality of the end products.
How does wafer trimming work at the Photonics Systems Group?
The Photonics Systems Group’s systems have been successfully trimming circuits at wafer level for several decades.
The sophisticated solutions are used for everything from sensor production to highly complex mixed-signal circuits and prove their outstanding position in 24/7 operation every day for our blue-chip customers around the globe.
The systems can be equipped with a wide variety of chuck materials and laser sources to achieve optimum results on the wafer.
The systems can be used for offline fusing – also known as memory repair – and can also be connected to external test systems via ATI (Advanced Tester Interface).
Our application experts are on hand to help you select the right configuration and develop your new application.
The systems have a SECS/GEM interface and are fully automated.
The Photonics Systems Group is at your side as a strong partner – from the feasibility study to the selection of the optimum process machine and the appropriate level of automation – all from a single source.
Advantages of laser wafer trimming or fusing
- State-of-the-art wafer trimmer with self-check algorithms.
- Opening from the left with a pitch of up to >2.5µm.
- Advanced alignment procedures and the use of our proprietary Laser-Eye technology enable a system accuracy of 0.5µm in 24/7 operation without recalibration.
- Stable and sophisticated software interface with a wide range of functions as standard
- Opening of up to 2000 links per second
- Integration of testers (ATE) via real-time tester interface (ETI)
- Integration of the PSG tester (High precision, Force V, Force C, Multi Measurement Unit)
- Fully automatable process control including material handling
Our customized solutions
Do you have any questions or need support with your current project?
Our experts are on hand with help and advice.
Contact us today and benefit from our many years of experience and comprehensive know-how!
Previous slide
Next slide