Laser Structuring for Circuit Board Manufacturing
Laser structuring of printed circuit boards
Laser structuring is a non-contact process in which a pulsed laser beam locally vaporizes the material.
Thanks to ultrashort pulse laser technology, this process is fast and gentle on the material with minimal heat development to avoid delamination effects.
It has been used for almost two decades in the series production of printed circuit boards to define electronic tracks directly on the surface without masking and etching processes.
How does laser structuring of PCBs work at the Photonics Systems Group?
The process of direct laser structuring of printed circuit boards is particularly suitable for the production of small series such as probe cards.
The copper layer is removed down to the underlying dielectric by laser.
The process can be used selectively and therefore reliably with high yields. Elaborate exposure and etching steps are no longer necessary and enable faster and more cost-effective production.
Increasingly powerful laser sources are opening up the process of laser direct structuring for further applications.
The Photonics Systems Group’s solutions are sophisticated and specially designed for 24/7 operation.
On request, you can select automation options from our standard catalog.
The Photonics Systems Group is at your side as a strong partner – from the feasibility study to the selection of the optimum process machine and the appropriate level of automation – all from a single source.
Advantages of laser structuring compared to conventional drilling methods
- Direct laser structuring of the copper top layer of printed circuit boards
- The number of conventional process steps is reduced
- Environmentally harmful materials and residues are significantly reduced – this not only improves environmental protection, but also reduces disposal costs
- Strong localization of the energy input by means of ultrashort pulses leads to no significant heat input and no damage to the underlying material (dielectric)
- The reproduction of exact geometries on a wide variety of materials is possible without any problems (e.g. FR4, aluminum-coated PET films, ceramics, etc.).
- Unlimited editing of layouts
- Very fine structures of less than 10 µm can be produced with high precision in order to realize the highest line/space requirements
Our customized solutions
Do you have any questions, need support with your current project or want to get started in the world of laser direct structuring?
Our experts are here to help and advise you.
Contact us today and benefit from our many years of experience and comprehensive know-how!
Frequently asked questions about laser structuring
Can laser systems perform several work steps?
Yes! In addition to structuring, the Photonics Systems Group’s laser systems can also be used for marking, drilling, creating cavities and cutting, depending on the design.as required for depaneling, for example. Even in these applications, a laser system achieves an accuracy and speed that is far higher than that of conventional processes. The InnoLas Solution systems are even capable of running the corresponding processes in parallel.
What other methods are there for structuring printed circuit boards?
Photochemical processes, in which a layer of light-sensitive lacquer on the metallic conductor plate is exposed through a mask and then etched accordingly, are still the most widespread worldwide. This process not only leads to the aforementioned environmental impact, but also delays production, as the components cannot be processed in any other way during the process. Laser structuring, on the other hand, produces no chemical waste and further work steps can be carried out simultaneously during structuring.
Milling is a process used primarily in the production of prototypes. This involves mechanically structuring layers of copper. This process naturally causes metal dust and chips on the workpiece, and the milling head wears out quickly and therefore needs to be readjusted regularly. This also causes considerable loss of time and waste. A laser system, on the other hand, vaporizes the coating without leaving any residue.
What applications are the Photonics Systems Group's laser systems suitable for?
Our laser systems are suitable for a wide range of applications in almost all areas of the electrical industry. We are one of the leading suppliers of laser systems for absolutely residue-free and carbonization-free depaneling. If scoring is required before the final separation of the benefit, we also have a solution for this. Our systems are also suitable for laser drilling micro vias with high aspect ratios and diameters of up to 15 µm. To take account of the increasing miniaturization of modern electronic devices and their printed circuit boards, we also offer extensive solutions in the area of cavity production.
Of course, we combine all these solutions in a single laser system. In some cases, the individual processes can even be executed in parallel. Only laser cutting systems are this comprehensive and efficient!
Milling is a process used primarily in the production of prototypes. This involves mechanically structuring layers of copper. This process naturally causes metal dust and chips on the workpiece, and the milling head wears out quickly and therefore needs to be readjusted regularly. This also causes considerable loss of time and waste. A laser system, on the other hand, vaporizes the coating without leaving any residue.
Which lasers are used for structuring?
Our systems exclusively use ultrashort pulse lasers in the femtosecond and picosecond range in the ultraviolet, green and infrared parts of the spectrum. As a result, the heat input to the workpiece is significantly lower than with lasers used in the past, which worked with longer pulses. These properties ensure that the material to be removed evaporates without leaving any residue and that no carbonization occurs.
Milling is a process used primarily in the production of prototypes. This involves mechanically structuring layers of copper. This process naturally causes metal dust and chips on the workpiece, and the milling head wears out quickly and therefore needs to be readjusted regularly. This also causes considerable loss of time and waste. A laser system, on the other hand, vaporizes the copper layer without leaving any residue.