Laser Depaneling for Precision Material Processing
Laser depaneling of assembled printed circuit boards
Modern electronic components are becoming smaller and smaller, which also reduces the size of the PCBs while increasing their range of functions.
This is advantageous for users, but poses a challenge in production.
To simplify production, several PCBs are combined to form a so-called panel.
The process in which the individual, typically assembled PCBs are separated from the panel using a laser is known as laser depaneling.
How does laser depaneling work at the Photonics Systems Group?
In laser depaneling, the laser beam is guided quickly and precisely over the substrate with the help of a galvanometer scanner in order to remove the substrate layer by layer.
By precisely adjusting the laser power and the number of passes, an optimum compromise between quality and speed can be achieved.
A powerful process extraction system adapted to your requirements guarantees a virtually residue-free process.
The Photonics Systems Group’s unique process expertise enables you to achieve the optimum result for your specific requirements.
Our machine solutions are user-friendly, designed for 24/7 industrial operation and can be fully automated on request.
The Photonics Systems Group is at your side as a strong partner – from the feasibility study to the selection of the optimum process machine and the appropriate level of automation – all from a single source.
What are the advantages of the Photonics Systems Group's laser depaneling solutions?
- Efficient use of material: By dispensing with pre-routing, the amount of material used is significantly reduced.
This makes it possible to fit more PCBs on the same panel size. - Precise cuts: With an accuracy of up to 5µm, very small tolerances can be maintained on the PCB.
- Complete elimination of tabs: The use of full-cut technologies makes the use of tabs superfluous.
- Non-contact process: The laser works without mechanical stress or damage to the components and therefore allows cutting edges close to sensitive conductor path structures or components.
- No tool wear: As the laser works wear-free, there are no costs for tool changes and maintenance.
- Residue-free: The cutting edge is technically clean, as the laser vaporizes and extracts material directly, ensuring dust-free processing.
- Minimized thermal energy input: Cold ablation reduces the thermal influence and the heat-affected zone in the cutting zone.
- Carbonization-free processing: There is no material burning, which results in carbonization-free processing.
- Versatile material selection: The right laser can be used for almost any material.
- Complex cutting contours: Complex cutting contours and small radii can be realized without additional set-up times.
- Reduced failure rates: Stable process conditions without tool changes and reduced cleaning effort increase the reliability of the circuits.
- Reproducible process quality: Calibrated parameters ensure consistently high quality across all machines.
- Flexible integration: From stand-alone systems to fully integrated production lines, Industry 4.0-capable – everything from a single source.
Photonics Systems Group is a leading global supplier of laser machines for the depaneling of printed circuit boards.
With precise machines and over 2,000 systems worldwide, we offer flexible solutions for various production processes.
From stand-alone devices to fully automated production lines, including inspection and sorting, you can get everything from a single source.
Our wide range of laser options and system features allows you to find the right balance between cost and quality.
The clean cutting edge with minimal carbonization offers maximum precision.
Thanks to the double head option, we achieve unsurpassed speeds.
Superior accuracy is guaranteed.
The fully integrated automation ensures maximum utilization of the laser.
Our solutions
Do you have any questions or need support with your current depaneling project?
Our experts are here to help and advise you.
Contact us today and benefit from our many years of experience and comprehensive know-how!
Frequently asked questions about laser depaneling
Compared to mechanical cutting processes (milling, punching), InnoLas laser depaneling offers you many economic advantages:
- Fast production processes, more throughput
- No changing or wearing out of tools
- Longer service life of the machine (wear-free)
- Less material loss due to more filigree contour guides and closer positioning – distances between PCBs <0.5mm possible
- Fewer rejects thanks to contactless, vibration-free cutting and more stable processes
- Higher product quality and fewer rejects, including in after-sales of end products
No, because with InnoLas Solutions laser depaneling solutions, the heat input is not significant (HAZ/heat affection zone).
We use ultra-short pulse lasers that do not heat the material.
Instead of burning and forming soot, the material is vaporized directly during depaneling in a quasi-cold process.
The cut edges are therefore absolutely clean and can be cut to size. 100 % carbonization-free.
The temperature influence in the cutting area is only 30°-50°, i.e. lower than in the upstream soldering process.
On the contrary. Thanks to full automation with up to eight laser heads (multi-head system with Multi Beam Technology), a speed many times faster than that of a conventional milling machine can be achieved.
Marking on the fly (MOF) perfectly synchronizes the movement of the panel with the movement of the laser beam.
This saves an additional 40% of processing time.
The integration of an optimized scanner increases the accuracy in processing and the throughput in production, thus generating added value for the customer.
The modular systems from InnoLas Solutions achieve +/- 5 µm accuracy.
Stitching errors are avoided thanks to the overall processing of the pattern. Pulse on Demand (POD) also guarantees extremely precise processing.
Our machines therefore control and regulate the amount of energy applied at each location on the components, regardless of the complexity of the layout.
At the same time, throughput is increased as travel distances and subsequent calibration as well as downtimes are eliminated.
Classic methods for depaneling are cutting or scoring with wedge-shaped knives and cutting with a depaneling cutter or a saw.
Depaneling with a laser is already an established process.
Its advantages lie primarily in the high production quality, the very precise and gentle material processing without carbonization or similar and the fast processing times in production.
Modern electrical appliances are getting smaller and smaller.
As a result, the size of the circuit boards is also shrinking.
At the same time, the range of functions of these devices is increasing.
While this is good for users, it makes production much more difficult.
To simplify production, several PCBs are therefore combined to form a so-called panel.
Several PCBs are manufactured and assembled in large panels (also known as panels).
At the end of the manufacturing process, the individual PCBs must be separated from the panel. This process is known as depaneling.
When cutting PCB panels with a laser, the assembled PCBs are cut from a panel by a focused laser beam that vaporizes the material directly, layer by layer, very quickly.
Lasers can be used to create any number of extremely fine structures very easily.
The vapors produced during the cutting process are extracted, which also ensures that no deposits or residues remain on the finished product.
The price naturally depends very much on the size and features of the machine in question.
However, laser machines are no longer much more expensive than a milling machine.
In addition, the additional costs are usually quickly amortized by the elimination of wear parts and the higher production capacity.
The calibrated processes also mean that significantly fewer start-up parts and rejects are produced. The price/performance ratio of laser cutting systems has improved by a factor of 10 over the past 10 years.