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Laser micromachining of high-performance ceramic materials
Ceramics play a key role in the production of modern high-performance electronics due to their unique properties such as high temperature resistance, electrical insulation, mechanical strength and chemical stability. The processing of ceramics with ultrashort pulse lasers opens up outstanding possibilities and significantly improves critical properties such as fracture resistance and edge quality compared to pre-scribing and processing with CO₂ lasers.
How does laser processing of ceramics work at the Photonics Systems Group?
The Photonics Systems Group’s system technology has been used successfully for processing ceramic printed circuit boards for almost three decades.
Today, ultrashort pulse lasers and special high-performance Galvo systems are used almost exclusively to ensure optimum process results with maximum cycle times.
The Photonics Systems Group’s systems can be used for cutting, scribing and drilling in equal measure.
On request, the systems can also be equipped with metrology systems that can verify the trench depth directly after the process.
Our machine solutions for ceramic processing are user-friendly, designed for 24/7 industrial operation and can be fully automated on request. We also offer customized high-throughput systems that are specially tailored to your requirements.
The Photonics Systems Group is at your side as a strong partner – from the feasibility study to the selection of the optimum process machine and the appropriate level of automation – all from a single source.
Advantages of laser processing of ceramics
- Defined fracture lines: Laser scribing creates precise fracture lines with a constant depth, enabling clean and accurate separation of the ceramic substrates.
- Repeat accuracy: Consistent results thanks to high process stability and repeat accuracy.
- Smooth edges: The laser process produces smooth and clean edges, eliminating the need for post-processing.
- Improved breaking force: The breaking force for the subsequent processes can be precisely adjusted.
- Reduced thermal damage: Minimal heat input through the use of extremely short laser pulses.
- High edge quality: The precise energy input ensures a high level of technical cleanliness and no glazing effects.
- Increased throughput: High-speed processing with Galvo scanners ensures short process times, especially compared to conventional CO2 laser systems.
- Material diversity: Suitable for a wide range of ceramic materials, including AlO2, AlN, LTCC, HTCC, DCB and AMB substrates as well as composite ceramics.
- Versatile geometries: the use of modern laser technology enables the creation of any geometry.
- Smallest hole diameters: Enables holes with diameters of less than 20 µm, ideal for applications in microelectronics.
- Flexible drilling techniques: Depending on the hole diameter, ideal hole geometries are achieved by trepanning or percussion drilling.
- Cost reduction: Low maintenance and servicing costs due to contactless process and no mechanical wear.
- Efficiency: High process quality and productivity lead to cost-efficient production.
Our solutions
Do you have any questions or need support with your current project? Our experts are on hand with help and advice. Contact us today and benefit from our many years of experience and comprehensive expertise!
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