Products for laser processing
Circuit and Sensor Trimmer LT50x0
The LT50x0 Trim System from the Photonics Systems Group is the latest generation of systems for laser alignment of electronic components.
The system can be operated either with a proprietary measuring bridge from the Photonics Systems Group or with an externally integrated measuring system.
A high-precision stage system (x, y, z, theta), in combination with a powerful steel deflection system, enables the µm-precise positioning of the individual laser pulses on the material to be processed.
The system also has a high-resolution camera system for component registration as standard.
Lasertool for machining of ceramics CR20x0
The CR20x0 is a laser system used in the production of ceramic circuit boards.
The axes of the machine are driven by linear motors.
The result of this technology is a high traversing speed combined with very good axis dynamics.
The accuracy and precision of the system are derived from high-resolution glass scales, which are used as a measuring system in each axis.
Lasertool for microvia drilling and routing DR20x0 and DR30x0
Photonics Systems DR20x0 and DR30x0 series fulfills all requirements for drilling and routing of rigid and flexible PCB materials.
The solid granite base and state-of-the-art motor technology enable maximum precision and repeatability of the microvias and maximum contour accuracy of the cuts.
State-of-the-art picosecond laser sources are used for minimum heat-affected zone and maximum process control.
The DR20x0 and DR30x0 series are equipped with our InfinityScan feature which controls stage and galvo simultaneously.
This makes stitching errors a thing of the past.
Lasertool for structuring DR20x0 and DR30x0
Photonics Systems is the market leader in structuring printed circuit boards of any material with a precision of up to +/- 5 µm.
We supply the right machine for every processing and manufacturing process.
A choice of laser options and different system features depending on the application allows you to find the right balance between cost and quality for your applications.
High-speed depaneling DP10x0
Photonics Systems DP10X0 series fulfills all requirements for laser depaneling of rigid and flexible PCB materials.
Our laser processes are fast, stress-free and clean.
The FULL-CUT process increases material utilization and reduces costs.
Modular automation concepts integrate the DP10X0 series into any production line.
Laser systems for the photovoltaic industry
The Photonics Systems Group uses innovations in laser technology to develop highly efficient machine solutions for the photovoltaic industry.
We select the optimum laser source and configure the optical path for each process application.
Our high-performance production systems achieve maximum throughput in 24/7 operation.
We also offer smaller systems for pilot production or R&D.
Thanks to the modular platform concept, each of our laser systems can be individually configured for the respective process application and designed as a stand-alone machine or for inline integration.
Wafer Trimmer M350
The M350 Wafer Trim System from the Photonics Systems Group was designed from the outset for processing wafers and is therefore able to cut 2 µm wide links.
A high-precision staging system (x, y, z, theta), in combination with a powerful steel deflection system including feedback loop, enables the µm-precise positioning of the individual laser pulses on the wafer to be processed.
A high-resolution camera system is used to detect the structures.