Laser for micromaterial processing of ceramics CR20x0

The CR20x0 is a laser system used in the production of ceramic circuit boards.

The axes of the machine are driven by linear motors. The result of this technology is a high traversing speed combined with very good axis dynamics. The accuracy and precision of the system are derived from high-resolution glass scales, which are used as a measuring system in each axis.

Highlights

Ultra-short pulse laser technology
high process speed on all ceramic substrates (i.e. Al2O3, AlN, Si3N4, SiO2, ZrO2, HTCC, LTCC)
30μm minimum hole diameter
Can be extended to several process heads on request

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CR2000

Laser system for the individual processing of ceramic substrates
Highlights:

Green picosecond for the smallest hole diameters
<5µm accuracy
Fully automatable

Technical data

CR2010

Laser system for processing ceramic circuit boards
Highlights:

Green picosecond for the smallest hole diameters
<5µm accuracy
Fully automatable

Technical data

CR2020

Laser system for processing DCB and AMB circuit boards in power electronics
Highlights:

IR picosecond for maximum process speed
Optional metrology
Fully automatable

Technical data

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Laser for micromaterial processing of ceramics CR20x0

Highlights

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